section sensitivity

用法例句

The Technology of Automatic Shift and Modify Zero Point for the Thickness Sensors;

厚度传感器接口电路中自动换挡及调零技术

New ice thickness sensor based on electric conduction characteristic of water and ice;

基于冰和水导电特性的新型冰层厚度传感器

The Designation of Ice Thickness Sensor Based on CPLD;

基于CPLD的冰层厚度传感器的设计

Applied Research on Sensor of Ice Thickness in Ice Thickness Detection System

冰层厚度传感器在冰层厚度检测系统中的应用研究

The Design of a Sensor Measuring the Oil Film Thickness between Cylinder and Piston Ring in Diesel Engine;

柴油机缸套—活塞环油膜厚度传感器的设计

Research and Application on the New System of Sensors Detecting the Thickness of Ice Level;

冰层厚度传感器检测新系统的性能研究、设计及应用

The New Ice Layer Thickness Sensor and Its Measuring System with 1-wire Temperature Gradient Detection Function;

具有总线温度梯度自动检测功能的新型冰层厚度传感器及其检测系统的研究

Study on the Thickness of Sensitive Layer of Surface Acoustic Wave Gas Sensor

声表面波气敏传感器敏感薄膜厚度的研究

Research on Thick-film Integrated Technology of Digital Accelerometer;

数字式加速度传感器的厚膜混合集成技术研究

Research on the Duallight Displacement Sensor for Measuring the Thickness of Rubber;

用于橡胶厚度测量的双光路位移传感器的研制

A Coating Thickness Measurement System Based on Fringing Electric Field Sensor

基于边缘电场传感器的涂层厚度检测系统

Thick-film hybrid integrated capacitive accelerometer

基于厚膜混合集成的电容式加速度传感器

depth sensor/depth meter

深度传感器(潜水)

What material is used for the FOXY Fiber Optic Oxygen Sensor probe coating and what is its thickness?

FOXY 光纤氧气传感器探测涂层使用什么材料及其厚度？

Study of Directly Fabricating Thick Film Thermosensor by Laser Micro-Cladding Technique;

激光微细熔覆直写技术制作厚膜温度传感器的初步研究

Research on Thick Film Hybrid Integration Fabrication and Program of Micromechanical Accelerometer;

硅微加速度传感器厚膜混合集成方案与工艺研究

Study of Biofilm Thickness Online Measure System Using Fiber Sensor Based on Absorbance

基于光吸收的生物膜厚度在线测量光纤传感器系统研究

Research on Adulteration of SrTiO_3 Thick Film Sensor;

SrTiO_3厚膜传感器的掺杂研究

Researches on SrTiO_3 Thick Films of Automobile Exhaust Gas Sensors;

汽车用SrTiO_3厚膜氧传感器研究

Thick Film Integration Package Technology for Pressure Sensor

压力传感器的厚膜混合集成封装技术